| 1. | Mechanical standardization of semiconductor devices - coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化.半导体器件封装外壳形式的分类和编码系统 |
| 2. | Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化.第4部分:半导体器件封装外壳形式的分类和编码系统 |
| 3. | Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages 半导体装置的机械标准化.第4部分:半导体装置封装外部形状的分类和编码系统 |
| 4. | Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 2 半导体器件的机械标准化.第4部分:半导体器件封装外壳形式的分类和编码系统.修改件2 |
| 5. | Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 1 半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统.修改件1 |